The CAN programme teams are designing architectures that integrate computing functions directly into memory and sensors.
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The CEA pioneered 2.5D and 3D integration with its IntAct circuit and has held on to its position as a leader in 3D integration ever since. Recent research by two CEA-List PhD students has led to significant advances in communications and security.
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The CEA has been conducting R&D on resistive memory (ReRAM)— an alternative to flash memory—for more than a decade. A complete system integrating ReRAM into a processor architecture was recently designed and validated for advanced memory company Weebit Nano.
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