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DATE 2023

#embedded systems #microelectronics

The CEA-List will participate in the 25th edition of the international DATE conference which will be held from April 17 to 19, 2023 in Antwerp, Belgium.

From 17 Apr. To 19 Apr 2023
ADD TO CALENDAR 20230417 20230419 France The CEA-List will participate in the 25th edition of the international DATE conference which will be held from April 17 to 19, 2023 in Antwerp, Belgium. <p><strong>It is the largest European gathering in the fields of microelectronics design and embedded systems and this is  an opportunity to discover the research activities of the CEA-List in those fields. </strong></p> <p>Meet CEA-List  experts’  during the following technical  sessions:</p> <ul> <li><strong>Workshop « W01 Eco-design and circular economy of Electronic System »</strong></li> </ul> <p>This workshop will be presented by <strong>Chiara Sandionigi</strong> and David Bol and held on <strong>Monday 17 April 2023 from 2:00PM to 6:00PM.</strong></p> <p><strong>Abstract:</strong></p> <p>The impact of electronics on the environment is becoming an important issue, especially because of the number of systems growing exponentially.</p> <p>Eco-ES is devoted to Eco-design and circular economy of Electronic Systems. The objective of Eco-ES is to gather experts from both academia and industry, covering a wide scope in the environmental sustainability of Electronic Systems. Besides regular sessions with talks, a debate panel will offer a place for the audience to discuss and share ideas.</p> <ul> <li><strong>Workshop « W02 3D integration &#8211; Heterogenerous 3D architectures and Sensors »</strong></li> </ul> <p>This workshop will be presented by <strong>Pascal VIVET</strong> and will be held on <strong>Wednesday 19 April from 2:00PM to 6:00PM.</strong></p> <p><strong>Abstract:</strong></p> <p>3D technologies are becoming more and more pervasive in digital architectures, as a strong enabler for heterogeneous integration.</p> <p>The 3D Integration Workshop took place in DATE conference from 2009 to 2015 and took place again in 2022. With the continued evolution of 3D technologies in terms of interconnect density and its evolving manufacturing eco-system, there is a strong need to pursue the research efforts on key aspects of architecture and design, according to the potential capabilities offered by 3D integration.</p> <p>The goal of the 3D Integration Workshop is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.</p> <p>This half-day event consists of a plenary keynote, invited talks, and regular presentations.</p> <p><strong>For more informations : <a href="https://www.date-conference.com" target="_blank" rel="noopener">https://www.date-conference.com</a></strong></p>

It is the largest European gathering in the fields of microelectronics design and embedded systems and this is  an opportunity to discover the research activities of the CEA-List in those fields.

Meet CEA-List  experts’  during the following technical  sessions:

  • Workshop « W01 Eco-design and circular economy of Electronic System »

This workshop will be presented by Chiara Sandionigi and David Bol and held on Monday 17 April 2023 from 2:00PM to 6:00PM.

Abstract:

The impact of electronics on the environment is becoming an important issue, especially because of the number of systems growing exponentially.

Eco-ES is devoted to Eco-design and circular economy of Electronic Systems. The objective of Eco-ES is to gather experts from both academia and industry, covering a wide scope in the environmental sustainability of Electronic Systems. Besides regular sessions with talks, a debate panel will offer a place for the audience to discuss and share ideas.

  • Workshop « W02 3D integration – Heterogenerous 3D architectures and Sensors »

This workshop will be presented by Pascal VIVET and will be held on Wednesday 19 April from 2:00PM to 6:00PM.

Abstract:

3D technologies are becoming more and more pervasive in digital architectures, as a strong enabler for heterogeneous integration.

The 3D Integration Workshop took place in DATE conference from 2009 to 2015 and took place again in 2022. With the continued evolution of 3D technologies in terms of interconnect density and its evolving manufacturing eco-system, there is a strong need to pursue the research efforts on key aspects of architecture and design, according to the potential capabilities offered by 3D integration.

The goal of the 3D Integration Workshop is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.

This half-day event consists of a plenary keynote, invited talks, and regular presentations.

For more informations : https://www.date-conference.com

ADD TO CALENDAR 20230417 20230419 France The CEA-List will participate in the 25th edition of the international DATE conference which will be held from April 17 to 19, 2023 in Antwerp, Belgium. <p><strong>It is the largest European gathering in the fields of microelectronics design and embedded systems and this is  an opportunity to discover the research activities of the CEA-List in those fields. </strong></p> <p>Meet CEA-List  experts’  during the following technical  sessions:</p> <ul> <li><strong>Workshop « W01 Eco-design and circular economy of Electronic System »</strong></li> </ul> <p>This workshop will be presented by <strong>Chiara Sandionigi</strong> and David Bol and held on <strong>Monday 17 April 2023 from 2:00PM to 6:00PM.</strong></p> <p><strong>Abstract:</strong></p> <p>The impact of electronics on the environment is becoming an important issue, especially because of the number of systems growing exponentially.</p> <p>Eco-ES is devoted to Eco-design and circular economy of Electronic Systems. The objective of Eco-ES is to gather experts from both academia and industry, covering a wide scope in the environmental sustainability of Electronic Systems. Besides regular sessions with talks, a debate panel will offer a place for the audience to discuss and share ideas.</p> <ul> <li><strong>Workshop « W02 3D integration &#8211; Heterogenerous 3D architectures and Sensors »</strong></li> </ul> <p>This workshop will be presented by <strong>Pascal VIVET</strong> and will be held on <strong>Wednesday 19 April from 2:00PM to 6:00PM.</strong></p> <p><strong>Abstract:</strong></p> <p>3D technologies are becoming more and more pervasive in digital architectures, as a strong enabler for heterogeneous integration.</p> <p>The 3D Integration Workshop took place in DATE conference from 2009 to 2015 and took place again in 2022. With the continued evolution of 3D technologies in terms of interconnect density and its evolving manufacturing eco-system, there is a strong need to pursue the research efforts on key aspects of architecture and design, according to the potential capabilities offered by 3D integration.</p> <p>The goal of the 3D Integration Workshop is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.</p> <p>This half-day event consists of a plenary keynote, invited talks, and regular presentations.</p> <p><strong>For more informations : <a href="https://www.date-conference.com" target="_blank" rel="noopener">https://www.date-conference.com</a></strong></p>