The semiconductor industry faces mounting challenges, including the physical limits of traditional copper interconnects, increasingly stringent power budgets, and the urgent need for flexible, scalable computing architectures. By integrating short-reach, high-bandwidth optical links for energy-efficient data movement and customizable RISC-V processor architectures, the collaboration directly addresses these constraints and establishes a new paradigm in high-performance data transport and computing architecture.
RISC-V is transforming processor design by combining openness, flexibility, and cost efficiency. Its customizable architecture allows industrial players to develop solutions tailored to their needs. Our joint effort will give customers a customizable compute platform that meets the performance and power targets.
In the collaboration, microLED is a critical enabling technology that will boost optical-communication throughput using low-power GaN LED solutions.
This collaboration enriches PSMC’s 3D stacking and interposer technology envelope with high-efficiency RISC-V computing IP and high-bandwidth silicon photonics chiplet communication. By leveraging the expertise of CEA-Leti and CEA-List alongside PSMC’s technologies, we will provide foundry services to customers for next-generation AI applications.